Showing 33–48 of 98 results
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Epotek 730-BLK
High quality general purpose Epoxy Structural and Potting Adhesive. Room Temperature Cure to mild heat cure. Use cases are sealing, potting or encapsulation in semiconductor, electronics assemblies, optical , medical device-equipment applications. Black version of Epotek 730.
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Epotek EJ2189
This adhesive is electrically conductive and thermally conductive , silver filled. Smooth Thixotropic paste allows for easy dispensing, stamping and hand application. Cure is room temp and heat curable option. Applications for EMI seals, RF shielding, ITO interconnects, LCD connects, cryogenic applications, die attach.
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Epotek EJ2189-LV
This adhesive is electrically conductive and thermally conductive , silver filled. Cure is room temp and heat curable option. Applications for EMI seals, RF shielding, ITO interconnects, LCD connects, cryogenic applications, die attach.Lower viscosity version of Epotek EJ2189.
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Epotek EK2000
Material is electrically and Thermally conductive. Enables high performance thermal interconnections. Low Viscosity and high thixotropy enables easy dispensing. Applications are for power electronics, high power LED Thermal Management, Solar CPV module thermal interconnects, higher flexibility than solder for thermal miss-match applications
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Epotek H20E
Electrically and thermally conductive adhesive. Heat cure only. Applications include die attach, quartz attach, piezo connections , EMI shielding-sealing, Solar interconnects and thermal management, LED Thermal Management.
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Epotek H70E
Good thermal conductivity, black in color, electrically insulative adhesive. Applications include glob top, chip SMT part protection, COB.
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Epotek H70E-2
Good thermal conductivity, black in color, electrically insulative adhesive. Applications include glob top, chip SMT part protection, COB.
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Epotek H74
Thixotropic paste like adhesive with good thermal conductivity and electrically insulative. Cure is minimum 100 Deg C. Use cases such as die attach, heat dissipation, hermatic sealing in general.
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Epotek MED-198-54
Low Vvscoisty Biocompatible / Shadow cure Capable UV Epoxy ISO-10993 Tested and Certified for Medical Device Applications.
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Epotek MED-301
Biocompatible optically clear, room temp or mild heat cure and low viscosity. Cured at 65 Deg C for 1 hour material can meet ISO10993-4/-5/-6/-10/11 certifications. Max mix volume 25gm.
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Epotek MED-301-2
Biomedical compliant , optically clear , long pot life , room temp or mild heat cure. Cured at 45 DegC for 16 hours complies with ISO10993-4/5/6/10/11 certifications.
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Epotek MED-301-2FL
Optically clear , long port life flexible version of Epotek MED 301-2. Heat cure of 60 Deg C for 4 Hours passes ISO10993-5 test protocols .
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Epotek MED-302-3M
Excellent water , chemical and solvent resistance , acetone, up to 10% nitric Acid, Hexane and dichloromethane. Heat cure of 80 Deg C for 2 Hours passes ISO10993-5 test protocols .
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Epotek MED-353ND
High end reliable epoxy for sealing, bonding. heat cure at 150 DegC for 1 Hour adhesive passes ISO10993 -4/-5/-6,-10,-11 test protocols .
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Epotek MED-H20E
Electrical and thermally conductive adhesive. Bio compatibility based on heat cure at 150 DegC for 1 Hour adhesive passes ISO10993/-4/-5/-6,-10,-11 test protocols .
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EPOTEK MED-OG116-31
Biocompatible / Shadow cure Capable UV Epoxy ISO-10993 Tested and Certified for Medical Device Applications. Material is thixotropic , has high Tg and high chemical resistance.