Epotek H70E epoxy is a thermally conductive, electrically insulating two-component adhesive. It is built for high-reliability microelectronic and power packaging.

Key Features of Epotek H70E Epoxy

• Pot life up to 4 days
• NASA-approved low outgassing
• Perfect for heat sink attach

Strong Thermal Management

H70E has a high glass transition temperature and excellent thermal management. As a result, it is a leading choice for heat sink attachment, chip-on-board (COB) assembly and power module encapsulation.

Long Pot Life

This is a heat-cure-only system. So it offers a very long pot life of up to 4 days and a stable viscosity. In addition, that makes it ideal for high-speed dispensing or screen printing.

Trusted for Space

As a NASA-approved low-outgassing adhesive, H70E suits space-grade and high-vacuum environments. Therefore, it protects sensitive optics and semiconductors from outgassing.

Why Choose Epotek H70E Epoxy?

It offers rugged chemical resistance and withstands extreme thermal cycling. For example, it keeps heat-generating parts securely bonded and cool for the life of the device.

Because it stays workable for days, it also reduces waste on long production runs. That helps you get more from every batch you mix.

Browse our full range of thermally conductive adhesives to compare options for your design.