FS BONDTEC 5632i Deep Access Wedge-Wedge Bonder
- Semi-automatic wedge-wedge bonder, fills the gap between the manual 53xx series and a fully automatic bonder
- Can also be used as a Ribbon-Bonder
- Based on the 5600i series, fully PC controlled
- Cross hair targeting system for pre-programmed adjust points
- Two operating modes: single bond (manual-automatic) and multi wire (semi and fully automatic)
- Convertible to Gold Wire, Ball or Alu Heavy Wire bonder, or pull-/shear tester, by replacing the bond head
- Set-up time of approximately 5 minutes
The FS BONDTEC 5632i Deep Access Wedge-Wedge Bonder is a semi-automatic bonder that fills the gap between the manual Wedge-Bonder series 53xx and a fully automatic bonder. The FS BONDTEC 5632i Deep-Access Bonder can also be used as a Ribbon-Bonder, offering added flexibility from a single platform. Based on the 5600i series, it is fully PC controlled and allows any number of bonds to be programmed.
Pre-programmed adjust points on the FS BONDTEC 5632i are targeted through the camera’s cross hair targeting system, with programmed bonds executed automatically. Two operating modes are available: single bond for repairing various bond samples and making individual bonds (manual-automatic), and multi wire for teaching and bonding chips or various bond samples (semi and fully automatic).
The FS BONDTEC 5632i can also be used as a Gold Wire, Ball or Alu Heavy Wire bonder, as well as a pull-/shear tester, simply by replacing the bond head and loading the appropriate software. With a set-up time of approximately 5 minutes, it offers a flexible platform for facilities working across multiple bonding processes.
Bond System
| Attribute | Detail |
|---|---|
| Wire types | Aluminium and gold wire 12.5–75μm on 2″ spool; ribbons from 30×12.5μm to 250×25μm |
| Bondhead | Wedge-Wedge for ribbon and thin wire, standard tool of 1″ length, ¾” (optional), motorized wire spool (optional) |
| Ultrasonic System | F&S US System 100kHz (optional 65, 120, 140kHz) |
Bonder Base
| Attribute | Detail |
|---|---|
| Axes | Working area X/Y-axis 100 x 100mm, step resolution 1μm programmable, programmable Z-axis with 60mm stroke |
| Hardware | Dual-Core PC with Windows OS Ethernet, USB 2.0/3.0, LCD colour display 22″, GigE-CMOS-Color camera, network compatible with program archiving |
| Software | Single bonds up to complex programs, loop shapes can be saved in libraries, optional pattern recognition |
| Placement accuracy | +/- 5μm @ 3 sigma, incl. tool / no wire on FS BONDTEC standard substrate |
| Repeatability | +/- 3μm @ 3 sigma, incl. tool / without wire on FS BONDTEC standard substrate |
| Loop height accuracy | +/- 5μm @ 3 sigma, for thin wire 5630i with 25μm aluminium wire on FS BONDTEC standard substrate |
| Speed | 1 wire / 2–3 seconds |
| Dimensions | W x D x H – 70 x 65 x 70cm, weight approx. 75kg |
| Connections | 100–240 VAC, 1 Phase, 50/60Hz, max 500VA, Ø6mm standard vacuum tubing |
| Heater controller | Integrated in the machine, 0–250°C |
Workholder
| Type | Detail |
|---|---|
| Standard | Workholder for parts up to 4×4″ with vacuum and mechanical clamping |
| Optional – Jaws | Workholders up to 4×4″ with jaws |
| Optional – TO | TO workholder with mechanical clamping |
| Optional – Rubberized | 4×4″ workholder with rubberized surface and mechanical clamping |
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