Showing 17–32 of 98 results
-
Ecorel Easy 802S
Long Stencil Life and ideal for Pin in paste process
-
Ecorel Easy 803M T4
20 – 38 micron Mesh size Targeted for defence with high thermal profile and coating application
-
Ecorel Easy 803S
Long Stencil Life ideal for Pin in Paste
-
Ecorel Easy 862
Very good vettability, Shiny finish without any graping
-
Ecorel Easy 862 T4
20 – 38 micron Mesh size for ultra fine pitch printing
-
Ecorel Free LT 140-18
Recommended for temperature sensitive components. Excellent printing capabilities
-
Epotek 301 Optically Clear Epoxy Adhesive
Epotek 301 Optically Clear Epoxy Adhesive uses room temp or mild heat cure and low viscosity. For applications like optical lenses bonding , underfill , sealing small sensor potting, medical device. Adhesion to glass, quartz, metals, most plastics. NASA Approved, low out gassing. Max mix volume 25gm. *Epotek 301 is currently facing extended lead times … Continue reading Epotek 301 Optically Clear Epoxy Adhesive
-
Epotek 301-2
Optically clear , long pot life , UV resistant up to 17 Days continuous UV exposure, room temp or mild heat cure for applications like optical lenses bonding , optical splicing , glob top, underfill , wire bond encapsulation , sealing small sensor potting. Adhesion to glass, quartz, metals, most plastics.NASA Approved, low out gassing.
-
Epotek 301-2FL
Optically clear , long port life flexible version of Epotek 301-2. Applications for optical lenses bonding , optical splicing , glob top, wire bond encapsulation , sealing small sensor potting, max 25 gm mix mass.
-
Epotek 302
Optically clear , fast gel and cure in 2-3 hours, optical lense bonding , optical splicing , sealing small sensor potting, max 25 gm shot mix mass.
-
Epotek 302-3M
Excellent water , chemical and solvent resistance , acetone, up to 10% nitric Acid, Hexane and dichloromethane. Suggested applications Fibre-Optics, small volume potting, bonding to glass, SST , quartz, Kovar and ceramic substrates, Optically Transmissive VIS/NIR range 350-1550nm for optical applications Max 25gm per mix volume.
-
Epotek 302-3M-BLK
Excellent water , chemical and solvent resistance , acetone, up to 10% nitric Acid, Hexane and dichloromethane. Suggested applications Fibre-Optics, small volume potting, bonding to glass, SST , quartz, Kovar and ceramic substrates. Opaque black version of Epotek 302-3M
-
Epotek 353ND
High end reliable epoxy for sealing, bonding, Fiber optic Termination Ferrals ,- Approved by TE connectivity for use in there connectors, Sensor Encapsulation, Piezo Bonding, Coil-Ferrite Bonding, SST, Magnets. Exhibits high Chemical resistance, high operational temperatures. NASA Approved, low out gassing.
-
Epotek 730
High quality general purpose Epoxy Structural and Potting Adhesive. Room Temperature Cure to mild heat cure. Use cases are sealing, potting or encapsulation in semiconductor, electronics assemblies, optical , medical device-equipment applications.
-
Epotek 730-110
High quality general purpose Epoxy Structural and Potting Adhesive. Room Temperature Cure to mild heat cure. Use cases are sealing, potting or encapsulation in semiconductor, electronics assemblies, optical , medical device-equipment applications.
-
Epotek 730-110-BLK
High quality general purpose Epoxy Structural and Potting Adhesive. Room Temperature Cure to mild heat cure. Use cases are sealing, potting or encapsulation in semiconductor, electronics assemblies, optical , medical device-equipment applications. Black color version of Epotek 730-110.