- • Dielectric strength 2500 V/mil
- • Touch dry under 60 seconds
- • Perfect for PCBA protection
- • Boiling Point: 43°C
- • Mono-Solvent Vapor Process
- • High Cleaning Power, Low GWP
- • Boiling Point: 49°C / 120°F
- • Perfect for Live Cleaning
- • Excellent Dielectric Performance
- • Removal of flux residues
- • Aqueous spray process
- • Totally water soluble
- • Melting point: 217°C
- • Cuts voiding in QFN/DPAK joints
- • Minimum pitch: 0.3mm
- • Melting point: 217°C
- • Excellent wetting on OSP finishes
- • Reliable for high-density boards
- • Melting point: 217°C (SAC305)
- • Type 4 powder: 20-38 micron
- • Perfect for micro-BGA, 0201
- • Melting point: 217°C (SAC305)
- • Type 5 powder: 15-25 micron
- • Built for micro-BGA density
- • Melting point: 217°C
- • Built for syringe dispensing
- • Surface resistance: >10¹⁰ Ω
- • Oil removal with temporary protection
- • Aqueous spray & flushing process
- • Totally water soluble
- • Oil & grease removal
- • Compatible with sensitive metals
- • Totally water soluble
- • Oil & Grease removal
- • Titanium & Aluminium safe
- • Totally water soluble
- • Oil & polishing paste removal with 1-3 days corrosion protection
- • Compatible with sensitive alloys
- • Oil & polishing paste removal with 3-7 days corrosion protection
- • Aqueous immersion process
- • Stripping of cured or polymerised substances
- • Aqueous immersion, flushing & co-solvent process
- • Boiling Point: 43°C
- • Vapor phase process
- • Removal of flux residues
