The 305-16 LVD T4 is a no-clean, lead-free, low voiding solder paste. It tackles the critical problem of voiding in power components and large contact areas such as QFNs and DPAKs.

Key Features of 305-16 LVD Low Voiding Solder Paste

• Type 4 powder (20 to 38 micron)
• Clear, colourless residue
• Perfect for QFNs and power parts

Less Voiding, Better Performance

The paste greatly reduces the size and percentage of gas pockets in solder joints. As a result, it improves both heat dissipation and electrical connection.

This helps ensure the long-term reliability of power-dense electronics.

Fine-Pitch Printing

Advanced Type 4 powder (20 to 38 micron) suits ultra-fine pitch printing. So you can use it on dense, modern boards.

Clean, Easy-to-Inspect Residue

The chemistry leaves a clear, colourless residue that stays clean after several reflow cycles. In addition, it supports easy visual inspection and strong first-pass yield in in-circuit testing (ICT).

Why Choose This Low Voiding Solder Paste?

It offers excellent wetting on all surface finishes. For example, it is a versatile, high-performance choice for manufacturers who cannot compromise on joint integrity.

Therefore, it helps you build power electronics that run cooler and last longer.

Browse our full range of lead-free solder paste to find the right match for your process.