Inventec 305-16 T4 is a no-clean, lead-free SAC305 solder paste made for fine pitch printing. It uses Type 4 powder with a particle size of 20 to 38 microns. As a result, it prints cleanly through small apertures on dense, modern boards.
Why choose 305-16 T4 solder paste?
As parts get smaller, standard pastes can clog apertures or cause bridging. For this reason, the 305-16 T4 uses a finer powder with a tight particle size range. This gives consistent stencil release and even deposit heights.
It offers the same strong wetting and reliable thermal performance as the standard 305-16 paste. In addition, the SAC305 alloy melts at 217°C, so it suits standard lead-free reflow profiles. The no-clean flux also means most users can skip cleaning after reflow.
Key features
- SAC305 lead-free alloy
- Melting point of 217°C
- Type 4 powder, 20 to 38 microns
- Consistent stencil release
- Even deposit heights for high yields
- No-clean flux
- Supplied in a 500 g jar
Where to use 305-16 T4 solder paste
This paste suits high-density assemblies where precision matters most. For example, it is a good fit for:
- Micro-BGA packages
- 0201 components
- Ultra-fine pitch parts
- Automated SMT production lines
Because the finer powder reduces bridging, you can expect higher first pass yields on complex boards.
Tips for best results
First, let the jar reach room temperature before you open it. Next, stir the paste gently to get an even mix. Then print and place your parts. Finally, reflow using a profile that suits your board and oven. Always check the datasheet for full storage and profile details.
Need help with your soldering process?
OnBoard Solutions supplies Inventec soldering materials to manufacturers across Australia. You can browse our full lead-free solder paste range or compare the Type 3 305-16 T3 solder paste. To learn more about soldering standards, visit the IPC website. Alternatively, contact our team to order 305-16 T4 today.