Thermasolv CF1
- • Boiling point: 170°C
- • Operates -100°C to 160°C
- • Ideal for immersion cooling
Thermasolv CF2
- • Boiling point: 110°C
- • Dielectric strength: 39.4kV
- • Ideal for immersion cooling
Thermasolv CF3
- • Boiling point: 120°C
- • Dielectric strength: >35.7kV
- • Ideal for immersion cooling
Thermasolv CF4
- • Boiling point: 98°C
- • Dielectric strength: 40kV
- • Perfect for semiconductor cooling
Thermasolv CF5
- • Boiling point: 110°C
- • Ultra-low GWP: 2.5
- • Ideal for semiconductor cooling
Thermasolv CF6
- • Boiling point: 158°C
- • Dielectric strength: 40kV
- • Ideal for immersion cooling
Thermasolv DC2
- • Boiling point: 26°C
- • Heat of vaporization: 163 J/g
- • Built for two-phase cooling
Thermasolv IM1
- • Boiling point: 61°C
- • Dielectric strength: 28kV
- • Ideal for data center cooling
Thermasolv IM2
- • Boiling point: 49°C
- • Dielectric strength: >40kV
- • Built for two-phase cooling
Thermasolv IM6
- • Boiling point: 47°C
- • Dielectric strength: 79kV
- • Built for two-phase cooling
Thermasolv IM7
- • Boiling point: 76°C
- • Dielectric strength: >25kV
- • Works for 1 and 2-phase cooling
Thermasolv WB1
- • Boiling point: 111°C
- • Plant-based, biodegradable
- • Ideal for direct-to-chip cooling