The Inventec 305-21 T5 is a Type 5 solder paste for the most demanding microelectronic applications. Its ultra-fine powder (15 to 25 micron) delivers an excellent soldering result on the smallest deposits.
Key Features of 305-21 T5 Type 5 Solder Paste
- SAC 305 lead-free alloy
- 15 to 25 micron powder
- Perfect for ultra-dense boards
No More Graping
The paste has anti-graping properties. As a result, even the smallest solder deposits coalesce fully during reflow. This helps prevent common defects on miniaturised SMT components.
Reliable Residues
The 305-21 T5 passes the Bone Corrosion Test. Therefore, its residues are safe for long-term operation in sensitive environments.
Built for Fine-Pitch Printing
The fine-grain distribution suits high-speed printing on ultra-dense boards. In fact, it gives consistent results where standard Type 3 or Type 4 pastes may struggle.
In addition, it comes in a convenient 500g jar for easy handling on the line.
Why Choose This Type 5 Solder Paste?
This paste is a professional choice for manufacturers pushing the limits of component density. For example, it suits next-generation assemblies with very small pads and tight pitches.
It also combines advanced chemical stability with the precision that modern electronics demand. So you can print finer features with confidence, run after run.
Browse our full range of lead-free solder paste to find the right match for your process.