Epotek EK2000 is a two-component silver filled epoxy adhesive. It is engineered for applications that need high thermal conductivity and low-temperature curing.

Key Features of EK2000 Silver Filled Epoxy

  • Low-temperature cure
  • High Tg and die shear strength
  • Perfect for LEDs and sensors

Safe for Heat-Sensitive Parts

Some components cannot handle the high cure temperatures of standard conductive epoxies. For example, high-brightness LEDs and specialised sensors need a gentler process. EK2000 solves this with a low-temperature cure.

Strong, Stable Bonds

EK2000 offers a high glass transition temperature (Tg) and excellent die shear strength. As a result, it forms a stable thermal and mechanical bond that resists extreme thermal cycling.

Easy to Apply

Its smooth, thixotropic consistency suits precision dispensing or screen printing. In addition, its low outgassing makes it suitable for high-vacuum and aerospace environments.

Why Choose This Silver Filled Epoxy?

EK2000 works well for die attach in power modules. It also serves as a heat-dissipating interface in high-density PCB assembly.

Therefore, it helps prevent overheating and supports long-term device stability. In short, it gives you strong thermal performance without the heat stress.

Because it suits both dispensing and screen printing, it also fits into many existing production setups.

Browse our full range of electrically conductive adhesives to compare options for your design.

Select Size

,

Reviews

There are no reviews yet.

Be the first to review “Epotek EK2000 Silver Filled, Low Temperature Cure Epoxy Adhesive”

Your email address will not be published. Required fields are marked *

You may also like…

Series 58xx Wire Bonder
Epotek EJ2189-LV Silver Filled RT Cure Epoxy Adhesive

Epotek EJ2189-LV Silver Filled RT Cure Epoxy Adhesive

  • • Low viscosity, precision dispensing
  • • Volume resistivity: ≤0.0005 Ω·cm
  • • Ideal for micro-SMD bonding
Epotek H20E Electrically Conductive  Epoxy Adhesive

Epotek H20E Electrically Conductive Epoxy Adhesive

  • • NASA low-outgassing approved
  • • Thermal conductivity: 29 W/mK
  • • Ideal for space-grade applications
T3002 PRO Manual DIE Bonder

Epotek EK2000 Silver Filled, Low Temperature Cure Epoxy Adhesive

Thermally conductive, silver-filled epoxy with low-temperature cure capabilities. Optimized for heat-sensitive SMT components and LEDs, featuring high Tg and high-reliability thermal management.

SKU: N/A Categories: Brand:
Talk to a Specialist