The Tresky T-3002-PRO series stands as the most flexible manual die bonding platform in the Tresky lineup, designed to handle everything from basic pick-and-place to the industry’s most advanced micro-assembly applications. Like all PRO models, it incorporates True Vertical Technology™ to ensure the chip and substrate remain perfectly parallel regardless of bond height, which is critical for ultrasonic and eutectic bonding. This system is uniquely equipped with Tresky’s specialized die ejector system, allowing for direct pick-up from wafers, Waffle packs, or Gel packs. The T-3002-PRO is highly modular, with application packages available for Flip-Chip, high bond force requirements, and ribbon bonding. Its combination of high-resolution optics and refined mechanical controls makes it the ideal platform for advanced research and pilot production where the ability to adapt to diverse component geometries is paramount.