The Tresky T3002 PRO die bonder is the most flexible manual die bonding platform in the Tresky range. It handles everything from basic pick-and-place to advanced micro-assembly.

Key Features of the T3002 PRO Die Bonder

• True Vertical Technology™
• Direct pick-up from wafers
• Perfect for R&D and pilot production

Perfect Parallelism

Like all PRO models, the T3002 PRO uses True Vertical Technology™. As a result, the chip and substrate stay perfectly parallel at any bond height. This is critical for ultrasonic and eutectic bonding.

Flexible Component Pick-Up

The system includes Tresky’s specialised die ejector. So you can pick up parts directly from wafers, Waffle packs or Gel packs.

Modular Application Packages

The T3002 PRO is highly modular. For example, you can add packages for flip-chip, high bond force and ribbon bonding as your needs grow.

Why Choose the T3002 PRO Die Bonder?

High-resolution optics work together with refined mechanical controls. Therefore, it is an ideal platform for advanced research and pilot production.

It also adapts easily to diverse component shapes and sizes. In short, it gives your team one flexible tool for many bonding tasks.

Because it is a manual platform, operators keep full control over each placement. At the same time, the optics and mechanics help them work accurately, even on very small parts.

Explore our full range of die bonding equipment to find the right system for your lab.