- • Light transmission: ≥99%
- • Lap shear: >2,000 psi
- • Operating temp: <300°C
- • 8-hour pot life
- • Light transmission: >99%
- • Operates -55°C to 200°C
- • Pot life: 10 hours
- • Light transmission: ≥99%
- • Lap shear: >2,000 psi
- • Volume resistivity: 2×10¹³ Ω·cm
- • Lap shear: 1,756 psi
- • Cures in 2 hours
- • Lap shear: >2,000 psi
- • Volume resistivity: 1×10¹³ Ω·cm
- • Operating temp: <250°C
- • Blocks light completely
- • Volume resistivity: 1×10¹³ Ω·cm
- • Ideal for security potting
- • Glass transition: ≥90°C
- • Gold standard for fiber optics
- • Cures in 1 minute
- • Lap shear: >2,000 psi
- • Ideal for vertical bonding
- • Operating temp: <250°C
- • Volume resistivity: ≤0.0005 Ω·cm
- • Perfect for EMI/RFI shielding
- • Room-temperature curing
- • Low viscosity, precision dispensing
- • Volume resistivity: ≤0.0005 Ω·cm
- • Ideal for micro-SMD bonding
- • Thermal conductivity: up to 35.5 W/mK
- • Great for die attachment
- • Low-temperature cure
- • NASA low-outgassing approved
- • Thermal conductivity: 29 W/mK
- • Ideal for space-grade applications
- • NASA-approved for space-grade use
- • Volume resistivity: 1×10¹³ Ω·cm
- • Perfect for heat sink attachment
- • Extended 2-day pot life
- • Thermal conductivity: 1.0 W/mK
- • Built for high-volume SMT lines
- • Passes NASA outgassing test
- • Cures below 120°C
- • Ideal for heat sink bonding
- • ISO 10993 certified biocompatible
- • Light transmission: ≥98%
- • Ideal for endoscope bonding
