Showing 225–240 of 272 results
Specialty Coating Systems (SCS) Parylene Family
- • USP Class VI certified
- • Pinhole-free molecular-level film
- • Exceptional dielectric strength
T6000 L/G Flexible High Precission Bonder
Fully Automated DIE Bonder
Thermasolv CF1
- • Boiling point: 170°C
- • Operates -100°C to 160°C
- • Ideal for immersion cooling
Thermasolv CF2
- • Boiling point: 110°C
- • Dielectric strength: 39.4kV
- • Ideal for immersion cooling
Thermasolv CF3
- • Boiling point: 120°C
- • Dielectric strength: >35.7kV
- • Ideal for immersion cooling
Thermasolv CF4
- • Boiling point: 98°C
- • Dielectric strength: 40kV
- • Perfect for semiconductor cooling
Thermasolv CF5
- • Boiling point: 110°C
- • Ultra-low GWP: 2.5
- • Ideal for semiconductor cooling
Thermasolv CF6
- • Boiling point: 158°C
- • Dielectric strength: 40kV
- • Ideal for immersion cooling
Thermasolv DC2
- • Boiling point: 26°C
- • Heat of vaporization: 163 J/g
- • Built for two-phase cooling