The Tresky T-6000-L/G is a fully automated, all-purpose die bonder for manufacturers moving from manual assembly to high-volume automated production. It pairs an ultra-stable granite gantry with high-precision motion control. The result is excellent placement accuracy and repeatability on every cycle.

Key Features of the T-6000-L/G Die Bonder

• Ultra-stable granite gantry base
• High-precision motion control
• Perfect for semiconductor and sensor assembly

Flexible Bonding Processes

The T-6000-L/G is built for flexibility. It supports a wide range of microelectronic applications, including adhesive bonding, thermosonic flip-chip assembly and traditional die attach.

As a result, one machine can cover several processes on your line. This makes it easier to take on varied jobs without adding extra equipment.

Modular Design for Future Growth

Its modular design allows for easy upgrades as your needs change. For example, you can add specialised loader and unloader modules to lift throughput as volumes grow.

In addition, the control software works hand in hand with the rigid mechanical base. Together, they give you a future-proof platform for complex micro-assembly.

Why Choose This Die Bonder?

The T-6000-L/G delivers the structural integrity and precision that advanced semiconductor and sensor manufacturing demands. Because of this, it is well suited to 24/7 production environments.

It also gives growing manufacturers a clear path forward. You can start with the core system today and then expand it later, rather than replacing your equipment.

Explore our full range of die bonding equipment to find the right fit for your facility.