The 5850 is a powerful, fully automatic heavy wire bondhead designed to meet the rigorous demands of high-power electronics and automotive battery module assembly. Compatible with the Series 58xx automatic platform, this head is capable of bonding large-diameter aluminum wire from 100 to 500 µm and copper wire from 100 to 300 µm. It is equipped with integrated Deformation Limit Control (DLC) technology, which provides real-time quality monitoring for every single bond to ensure zero-defect manufacturing. To accommodate extreme package depths, it supports wedge tool lengths from 50 to 70 mm and features a clip-on wire guide for rapid setup changes. Capable of performing continuous stitch or chain bonds of any length, the 5850 delivers the massive ultrasonic energy and precision force control necessary for reliable, high-current interconnects in a high-speed, automated production environment.