The FS BONDTEC 5310 is a high-precision manual ball bonder designed for the economical and flexible production of microelectronic connections using gold wire ranging from 17.5 to 50 μm. This versatile machine utilizes a dual-frequency ultrasonic generator (60/100 kHz) and is compatible with standard capillaries from 16 to 19 mm, making it ideal for prototyping, research, and small-batch manufacturing. The 5310 is highly programmable, allowing for advanced techniques such as bumping, safety-bumping, and stitch-on-ball bonding with a programmable Z-axis travel of 60mm. Its intuitive operation and compact desktop footprint provide an unbeatable combination of technical capability and cost-effectiveness. Whether working on sensor technology, LEDs, or complex hybrids, the 5310 provides the reliable gold-ball bonding performance required for high-reliability microelectronics where precision and manual control are paramount.