FS BONDTEC 5310 Ball-Wedge Bonder

  • Processes gold wires from 17.5 to 50 μm
  • Bumping mode and stitchbond mode
  • Motor-driven Z-axis for repeatable results
  • Colour display with shuttle-wheel input for easy programming
  • Manipulator system for creating different loop shapes
  • Minimal operator training required
  • Ideal for prototype, rework and small-scale production

The FS BONDTEC 5310 Ball-Wedge Bonder is part of F&S Bondtec’s 53xx Series, purpose-built to process gold wires from 17.5 to 50 μm using both bumping mode and stitchbond mode. Its motor-driven Z-axis ensures consistently repeatable results, while every bonding parameter can be saved to the internal hard disk for future recall.

Designed with ease of use in mind, the 5310 Ball-Wedge Bonder features a colour display and shuttle-wheel input that simplify machine programming, allowing operators to create a variety of loop shapes through its manipulator system. This straightforward handling means operators require only minimal training, making the 5310 Ball-Wedge Bonder an ideal choice for prototype development, rework and small-scale production runs.

Suited to complex bonding tasks that demand optimal quality at a favourable price point, the 5310 Ball-Wedge Bonder combines precision hardware with intuitive manual control, making it a dependable option wherever repeatable, high-quality gold-ball bonding is required without the overhead of a fully automatic system.

Bond System

Attribute Detail
Wire types Gold wire 17.5–50μm on 2″ spool
Bondhead Ball-Wedge for Gold wire, standard capillaries 16mm (optional 19mm)
Ultrasonic System F&S Generator 67kHz (optional 120, 130, 140kHz)

Bonder Base

Attribute Detail
Axes Programmable linear Z-axis with 60mm stroke, 1μm step resolution, standard working height 55mm, manipulator in X and Y 18x18mm, equivalent to 1:7
Hardware Stepper motor driven Z-linear axis, single-board PC, coin-guided teach-in, internal hard disk, menu-guided operation via shuttle wheel with confirmation button
Software Programmable single bonds, loop shapes can be saved
Control Manual
Dimensions W x D x H – 63 x 58 x 40cm, weight approx. 30kg
Connections 100–230 VAC, 1 Phase, 50/60Hz, max 230VA, Ø6mm standard-vacuum tubing
Heater controller Integrated in the machine, 0–250°C

Workholder

Type Detail
Standard Ø80mm workholder with mechanical clamping
Optional – Large parts Workholder for parts up to 4×4″ with vacuum and mechanical clamping
Optional – TO TO workholder with mechanical clamping
Optional – Rubbered 4×4″ workholder with rubbered surface and mechanical clamping

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5310 Gold Ball-Wedge Bonder

SKU: FSB-130

In Stock

Manual gold ball bonder for 17.5–50μm wire. Features dual-frequency ultrasonic technology, programmable Z-axis, and supports bumping and stitch-on-ball for high-precision microelectronics.

SKU: FSB-130 Category:
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