FS BONDTEC 5650iHR Heavy Ribbon Wedge-Wedge Bonder
- Semi-automatic heavy ribbon bonder, fills the gap between manual 53xxi bonders and a fully automatic bonder
- Based on the 56xxi series, fully PC controlled
- Cross hair targeting system for pre-programmed adjust points
- Two operating modes: single bond (manual-automatic) and multi wire (semi and fully automatic)
- Convertible to Au Wire or Al Thin Wire bonder, or pull-/shear tester, by replacing the bond head
- Set-up time of approximately 3 minutes
The FS BONDTEC 5650iHR Heavy Ribbon Wedge-Wedge Bonder is a semi-automatic Wedge-Wedge bonder that fills the gap between the manual Wedge-Bonder series 53xxi and a fully automatic bonder. Based on the 56xxi series, the FS BONDTEC 5650iHR is fully PC controlled and allows any number of bonds to be programmed, with pre-programmed adjust points targeted through the camera’s cross hair targeting system before the programmed bonds are executed automatically.
Two operating modes are available on the FS BONDTEC 5650iHR: single bond for repairing various samples to perform an individual bond (manual-automatic), and multi wire for teaching and bonding of single chips or various samples (semi and fully automatic). The bonder can also be used as an Au Wire or Al Thin Wire bonder, as well as a pull-/shear tester, simply by replacing the bond head and loading the appropriate software.
With a set-up time of approximately 3 minutes, the FS BONDTEC 5650iHR offers fast conversion between heavy ribbon and thin wire bonding processes, making it well suited to facilities that need flexibility without lengthy changeover downtime.
Bond System
| Attribute | Detail |
|---|---|
| Wire types | Aluminium ribbon up to 2000×300μm on 3.5″ spool; copper wire 300–500μm on 4″ spool |
| Bondhead | Wedge-Wedge for heavy ribbon or copper wire, standard wedges of 2″ length (up to 90mm), motorized wire spool (optional), programmable Voice-coil bond force system 0 up to 1,800cN (amplifiable up to 4,000cN) |
| Ultrasonic System | F&S Generator 60kHz (optional 40, 90, 120kHz) |
Bonder Base
| Attribute | Detail |
|---|---|
| Axes | Working area X/Y-axis 100 x 100mm, step resolution 1μm programmable, programmable Z-axis with 60mm stroke |
| Hardware | Dual-Core PC with Windows OS Ethernet, USB 2.0/3.0, LCD colour display 22″, GigE-CMOS-Color camera, network compatible with program archiving |
| Software | Single bonds up to complex programs, loop shapes can be saved in libraries, optional pattern recognition |
| Placement accuracy | +/- 5μm @ 3 sigma, incl. tool / no wire on FS BONDTEC standard substrate |
| Repeatability | +/- 3μm @ 3 sigma, incl. tool / without wire on FS BONDTEC standard substrate |
| Loop height accuracy | +/- 5μm @ 3 sigma, for thin wire 5630i with 25μm aluminium wire on FS BONDTEC standard substrate |
| Speed | 1 wire / 3 seconds |
| Dimensions | W x D x H – 70 x 65 x 70cm, weight approx. 75kg |
| Connections | 100–240 VAC, 1 Phase, 50/60Hz, max 500VA, Ø6mm standard vacuum tubing |
| Heater controller | Integrated in the machine, 0–250°C |
Workholder
| Type | Detail |
|---|---|
| Standard | Workholder for parts up to 6×6″ with vacuum and mechanical clamping |
| Optional – Large parts | Workholders up to 4×4″ with mechanical clamping |
| Optional – TO | TO workholder with mechanical clamping |
| Optional – Rubberized | 4×4″ workholder with rubberized surface and mechanical clamping |
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