Series 5830 Thin Wire Wedge-Wedge
Exchangeable Bondhead 5830
- Wedge-wedge bonding using 1″ tools for aluminum and gold wires from 17,5 to 75 µm strength
- 45° wire guide. convertible to 30° or 60° – depending on component geometry
- Digital ultrasonice generator provides adjustable bond frequencies
- Deformation Limit Control (DLC) for real-time quality check and process monitoring
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Series 5830 Thin Wire Wedge-Wedge
Exchangeable Bondhead 5830
