The 5850 Heavy Ribbon Bondhead is the fully automatic solution for high-power electronics manufacturing on the 58xx series platform. Designed for maximum productivity, it handles aluminum ribbons up to 2 mm in width with a programmable bond force that extends to 6,000 cN. The head is equipped with an active ribbon guide to ensure perfect loop shaping during high-speed automated movements, and it supports force and power ramps to maintain joint integrity. For quality assurance, the head features integrated Deformation Limit Control (DLC), which monitors every bond in real-time. This head is built for the most demanding industrial environments, providing the speed and massive power necessary for the automated assembly of power modules, solar inverters, and battery management systems where heavy-duty reliability is the primary requirement.