Series 5830 Thin Wire Wedge-Wedge
Exchangeable Bondhead 5830
- Wedge-wedge bonding using 1″ tools for aluminum and gold wires from 17,5 to 75 µm strength
- 45° wire guide. convertible to 30° or 60° – depending on component geometry
- Digital ultrasonice generator provides adjustable bond frequencies
- Deformation Limit Control (DLC) for real-time quality check and process monitoring
Series 5830 Thin Wire Wedge-Wedge
$0.00
Exchangeable Bondhead 5830
Your Basket
You do not have any products in your selection basket.