The Series 58xx from FS BONDTEC is a high-productivity “Desktop Factory” capable of automated wire bonding at speeds exceeding one wire per second. This tabletop unit bridges the gap between manual prototyping and full-scale automated production by offering exchangeable bondheads for all wire bonding processes. It features the most powerful pattern recognition system on the market, ensuring precise placement even on complex substrate geometries. The 58xx platform allows for the storage of an unlimited number of bond programs with extremely adaptable settings for loop shapes, bond force, and ultrasonic power profiles. Designed for high-speed manufacturing, it utilizes innovative software to streamline the transition from part feeding to final bond, providing unbeatable flexibility and high-yield results for microelectronic facilities requiring automated reliability in a compact footprint.