FS BONDTEC 5810 Ball-Wedge Bonder
- Gold wire Ball-Wedge version of the fully automatic Series 58xx wire bonders
- Exchangeable bond heads
- Fully automatic mode, ideally suited for medium-scale production
- Parts fed manually, bonds produced completely without operator influence
- Built-in pattern recognition for single bonds made within seconds
- Perfect for R&D, pilot manufacturing and middle volume production
The FS BONDTEC 5810 Ball-Wedge Bonder is the gold wire version of the automatic wire bonders in the Series 58xx, featuring exchangeable bond heads. Its fully automatic mode makes the FS BONDTEC 5810 ideally suited for medium-scale production — parts to be bonded are fed manually by the operator, but the bonds themselves are produced completely without operator influence.
Thanks to built-in pattern recognition, single bonds can be made within seconds on the FS BONDTEC 5810, making the machine perfect for R&D, pilot manufacturing and middle volume production environments that need consistent, high-quality bonds at speed.
Bond System
| Attribute | Detail |
|---|---|
| Wire types | Gold wire 12.5–50μm on 2″ spool |
| Bondhead | Ball-Wedge for gold wire, standard capillaries 16mm length (optionally 19mm) |
| Ultrasonic System | F&S Generator 67kHz (optional 120, 130, 140kHz) |
Bonder Base
| Attribute | Detail |
|---|---|
| Axes | Working area X/Y-axis 200 x 150mm, programmable step resolution 1μm, programmable Z-axis with 100mm stroke |
| Hardware | Dual-Core PC with Windows OS, Ethernet, USB 2.0/3.0, colour display 22″, GigE-CCD-Color camera (5 Mpixel), fully networkable in TCP/IP servers |
| Software | From single bonds up to complex programmes, loop shapes can be saved in libraries, optional pattern recognition |
| Control | High-performance embedded ARM-System with real-time operating system for precision, 1 wire/second |
| Placement accuracy | +/- 5μm @ 3 sigma, incl. tool / no wire on FS BONDTEC standard substrate |
| Repeatability | +/- 3μm @ 3 sigma, incl. tool / without wire on FS BONDTEC standard substrate |
| Loop height accuracy | +/- 5μm @ 3 sigma, for thin wire 5830 with 25μm aluminium wire on FS BONDTEC standard substrate |
| Dimensions | W x D x H – 92 x 71 x 65cm, weight approx. 80kg |
| Connections | 100–240 VAC, 1 Phase, 50/60Hz, max 230VA, Ø6mm standard vacuum tubing |
| Heater controller | Integrated in the machine, 0–250°C |
Workholder
| Type | Detail |
|---|---|
| Standard | Workholder for parts up to 8×6″ with vacuum and mechanical clamping |
| Optional – 6×6″ | 6×6″ workholder with vacuum and mechanical clamping |
| Optional – TO | TO workholder with mechanical clamping |
| Optional – Rubberized | 4×4″ workholder with rubberized surface and mechanical clamping |
