The FS BONDTEC 5832 is a deep-access wedge-wedge bonder from the fully automatic Series 58xx range. It offers exchangeable bond heads and produces consistent wire and ribbon bonds at speed.
Key Features of the FS BONDTEC 5832 Wedge-Wedge Bonder
- Deep-access wedge-wedge design
- Built-in pattern recognition
- Perfect for R&D and pilot production
Deep-Access Bonding
The 5832 is the deep-access version of the automatic Series 58xx wire bonders. As a result, it can reach bond sites that standard bond heads cannot.
In addition, exchangeable bond heads let you switch between thin wire and ribbon work as your needs change.
Fully Automatic Operation
Its fully automatic mode makes the 5832 ideal for medium-scale production. Operators load parts by hand. However, the machine then makes every bond without any operator influence.
Therefore, you get consistent results from one operator to the next.
Fast Setup With Pattern Recognition
Built-in pattern recognition lets you make single bonds within seconds. So you spend less time on setup and more time bonding.
Why Choose This Wedge-Wedge Bonder?
The FS BONDTEC 5832 suits R&D, pilot manufacturing and middle-volume production. For example, it is ideal for teams that need high-quality deep-access and ribbon bonds without slowing down.
It also handles a wide range of wire and ribbon sizes, as the table below shows.
Bond System
| Attribute | Detail |
|---|---|
| Wire types | Aluminium and gold wire 17.5–75μm on 2″ spool; ribbon from 30×12.5μm to 250×25μm |
| Bondhead | Wedge-Wedge for ribbon and thin wire, standard wedges of 1″ length (¾” optional), motorized wire spool (optional) |
Explore our full range of wire and ribbon bonders to find the right system for your application.
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