FS BONDTEC 5832 Deep-Access Wedge-Wedge Bonder
- Deep-Access wedge-wedge version of the fully automatic Series 58xx wire bonders
- Exchangeable bond heads
- Fully automatic mode, ideally suited for medium-scale production
- Parts fed manually, bonds produced completely without operator influence
- Built-in pattern recognition for single bonds made within seconds
- Perfect for R&D, pilot manufacturing and middle volume production
The FS BONDTEC 5832 Deep-Access Wedge-Wedge Bonder is the Deep-Access version of the automatic wire bonders in the Series 58xx, featuring exchangeable bond heads. Its fully automatic mode makes the FS BONDTEC 5832 ideally suited for medium-scale production — parts to be bonded are fed manually by the operator, but the bonds themselves are produced completely without operator influence.
Thanks to built-in pattern recognition, single bonds can be made within seconds on the FS BONDTEC 5832, making the machine perfect for R&D, pilot manufacturing and middle volume production environments that need consistent, high-quality deep-access and ribbon bonds at speed.
Bond System
| Attribute | Detail |
|---|---|
| Wire types | Aluminium and gold wire 17.5–75μm on 2″ spool; ribbon from 30×12.5μm to 250×25μm |
| Bondhead | Wedge-Wedge for ribbon and thin wire, standard wedges of 1″ length (¾” optional), motorized wire spool (optional) |
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