The Tresky T-5100 die bonder is a universal micro-assembly workhorse. It combines the hands-on flexibility of a manual bonder with the precision of semi-automatic processes.
Key Features of the Tresky T-5100 Die Bonder
- Sub-micron flip-chip placement
- True linear Z-axis
- Perfect for R&D and pilot lines
Outstanding Accuracy
The T-5100 offers superb accuracy and repeatability. In addition, a true linear Z-axis and high-resolution optics allow flip-chip placement with sub-micron accuracy.
Quick to Learn
The machine is very intuitive to use. As a result, operators typically need only minutes of training before starting high-precision work.
Compact and Rigid
An extremely rigid, compact base fits easily on a standard lab desk. Meanwhile, the W version supports a wafer table of up to 200mm with electronic die ejection.
Why Choose the T-5100 Die Bonder?
It handles ultrasonic bonding, high-force attachment and delicate eutectic processes. For example, one machine can cover many different micro-assembly and component placement tasks.
Therefore, the T-5100 gives R&D labs and pilot production lines a stable, adaptable platform for their most demanding work.
Explore our full range of die bonding equipment to find the right system for your lab.
