Series 53 Wire Bonder
The Series 53 Wire Bonder is a manual table-top wire bonder. It is built for development labs and low-to-medium volume production that need an unbeatable price-to-performance ratio. In addition, six exchangeable bond heads cover a wide range of processes. For instance, these include gold-ball, wedge-wedge, deep access, heavy wire, heavy ribbon and die-bonding work. As a result, you avoid buying a separate machine for each process.
- It is a complete, manual table-top bonder.
- In addition, it offers an unbeatable price-to-performance ratio.
- Bond settings, loop shapes, force and power profiles are extremely adaptable.
- Furthermore, a dual wire clamp system delivers reproducible loops and tails.
- It is also easy to handle.
- Finally, six exchangeable bond heads suit different applications.
Also, this bonder gives operators precise control over the bonding process. Because bond settings, loop shapes, force and power profiles are adaptable, it suits a wide range of materials and geometries. In addition, a dual wire clamp system ensures reproducible loops and tails. Meanwhile, easy handling means it suits both development environments and production settings that require flexibility.
The Series 53 Wire Bonder supports six exchangeable bond heads. Therefore, a single platform can be configured for many jobs. Specifically, these include gold-ball bonding, thin wire wedge-wedge bonding, deep access bonding, heavy wire and heavy ribbon bonding, or die-bonding. This modular approach means the machine can adapt as bonding requirements change. So, you do not need to invest in a completely new tool. Each bond head is purpose-built for its application, with programmable axes and adjustable bond force. Consequently, it can accommodate a broad range of wire bonding tasks across wire, ribbon and die-bonding processes.
Exchangeable Bond Heads
| Bond Head | Type | Key Specifications |
|---|---|---|
| 5310 | Gold-Ball | Wires 17.5-50 μm, standard capillaries 16-19mm, dual frequency US generator (60/100 kHz), bumping, safety-bump, stitch-on-ball, programmable Z-axis 60mm |
| 5330 | Thin Wire Wedge-Wedge | 1″ tools, aluminium/gold wires 17.5-75 μm, ribbon up to 250 x 25 μm, 45° wireguide (retrofitable to 30°/60°), dual frequency US generator, programmable Z-axis 60mm and Y-axis 25mm |
| 53XX BDA | Ball-Deep Access | Deep access wedge-wedge bonding with 1″ or ¾” tools, 90° wireguide, aluminium/gold wires 17.5-75 μm, gold-ball bonding 17.5-50 μm, suited to constricted geometries, programmable Z-axis 60mm and Y-axis 25mm, optional retrofit to 5380 die-bonder |
| 5350 | Heavy Wire | Aluminium wire 100-500 μm, copper wire 100-300 μm, wedge tool length 50-70mm, stitch or chain bonds of any length, clip-on wire guide, programmable Z-axis 60mm and Y-axis 25mm |
| 5350 HR | Heavy Ribbon | Aluminium ribbons up to 2mm width, programmable bond force up to 6,000 cN with force/power ramps, active ribbon guide, programmable Z-axis 60mm and Y-axis 25mm |
| 5380 | DIE-Bonder | Process-oriented for different die sizes, touchdown detection, programmable pickup and bond force, 2 x 2″ working area for waffle-, gel-packs or trays, bond/pickup force 5-500 cN programmable |
Many customers pair the Series 53 Wire Bonder with our 8600C Pull & Shear Tester. For example, development and pilot lines can verify bond strength straight after bonding. As a result, teams get an easy way to check quality without leaving the bench.
