The FS BONDTEC 5330 is a manual thin wire bonder with a wedge-wedge bondhead. It processes aluminium and gold wires from 17.5 to 75μm.

  • Processes aluminium and gold wires from 17.5 to 75μm
  • Ribbon bonding up to 250μm width via clamp
  • Mechanical manipulator system for creating different loop shapes
  • Automatic feed and tail function for user-friendly bonding
  • Colour display with shuttle-wheel input for easy programming
  • Motor-driven Z-axis for repeatable results
  • Minimal operator training required

Wire and Ribbon in One Thin Wire Bonder

Thanks to its clamp, the 5330 also bonds ribbons up to 250μm wide. In addition, the mechanical manipulator lets operators create different loop shapes with ease.

User-Friendly Bondhead

The bondhead has an automatic feed and tail function. As a result, bonding is smooth and user-friendly.

Simple, Repeatable Operation

A colour display and shuttle-wheel input make programming straightforward. Meanwhile, the motor-driven Z-axis gives consistent results, and you can save every parameter to the internal hard disk.

Why Choose This Thin Wire Bonder?

Operators need only minimal training on the 5330. Therefore, it is ideal for small-scale production, lab work, prototyping, pre-series builds and repairs.

For example, one machine can cover both wire and ribbon jobs across your development projects.

Bond System

Attribute Detail
Wire types Aluminium and gold wire 17.5–75μm on 2″ spool; ribbon up to 250μm width (optional)
Bondhead Wedge-Wedge for aluminium and gold wire, standard tool 1″ length, 45° wire feed, motorized wire spool (optional)
Ultrasonic System F&S Generator 100kHz (optional 67, 140kHz)

Bonder Base

Attribute Detail
Axes Programmable linear Z-axis with 60mm stroke, programmable linear Y-axis with 20mm stroke, standard working height 55mm, manipulator in X and Y 18x18mm, equivalent to 1:7
Hardware Stepper motor driven Z-linear axis, single-board PC, coin-guided teach-in, internal hard disk, menu-guided operation via shuttle wheel with confirmation button
Software Programmable single bonds, loop shapes can be saved
Control Manual, semi-automatic
Dimensions W x D x H – 63 x 58 x 40cm, weight approx. 30kg
Connections 100–230 VAC, 1 Phase, 50/60Hz, max 230VA, Ø6mm standard-vacuum tubing
Heater controller Integrated in the machine, 0–250°C

Workholder

Type Detail
Standard Ø80mm workholder with mechanical clamping
Optional – Large parts Workholder for parts up to 4×4″ with vacuum and mechanical clamping
Optional – TO TO workholder with mechanical clamping
Optional – Rubbered 4×4″ workholder with rubbered surface and mechanical clamping

Explore our full range of wire and ribbon bonders to find the right system for your application.

5330 Thin Wire Wedge-Wedge Bonder

SKU: FSB-021

In Stock

FS BONDTEC 5330 Thin Wire Wedge-Wedge Bonder processes aluminium and gold wires from 17.5 to 75μm, with clamp-based ribbon bonding up to 250μm width. Ideal for small scale production, laboratory, prototyping, pre-series and repair applications, the FS BONDTEC 5330 Thin Wire Wedge-Wedge Bonder requires only minimal operator training.

SKU: FSB-021 Category:
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