FS BONDTEC 5330 Thin Wire Wedge-Wedge Bonder

  • Processes aluminium and gold wires from 17.5 to 75μm
  • Ribbon bonding up to 250μm width via clamp
  • Mechanical manipulator system for creating different loop shapes
  • Automatic feed and tail function for user-friendly bonding
  • Colour display with shuttle-wheel input for easy programming
  • Motor-driven Z-axis for repeatable results
  • Minimal operator training required

FS BONDTEC 5330 Thin Wire Wedge-Wedge Bonder can process aluminium and gold wires from 17.5 to 75μm. Thanks to its clamp, it’s also possible to bond ribbons up to 250μm in width, while the mechanical manipulator system allows the operator to create different kinds of loops with ease.

The bondhead on the FS BONDTEC 5330 Thin Wire Wedge-Wedge Bonder is equipped with automatic feed and tail function, allowing optimal, user-friendly bonding. Handling is supported by a colour display and shuttle-wheel input, making machine programming straightforward, while the motor-driven Z-axis ensures consistently repeatable results with every parameter able to be saved to the internal hard disk.

Operators require only a minimum of training on the FS BONDTEC 5330 Thin Wire Wedge-Wedge Bonder, making it the ideal choice for small scale production, laboratory work, prototyping, pre-series builds and repair applications.

Bond System

Attribute Detail
Wire types Aluminium and gold wire 17.5–75μm on 2″ spool; ribbon up to 250μm width (optional)
Bondhead Wedge-Wedge for aluminium and gold wire, standard tool 1″ length, 45° wire feed, motorized wire spool (optional)
Ultrasonic System F&S Generator 100kHz (optional 67, 140kHz)

Bonder Base

Attribute Detail
Axes Programmable linear Z-axis with 60mm stroke, programmable linear Y-axis with 20mm stroke, standard working height 55mm, manipulator in X and Y 18x18mm, equivalent to 1:7
Hardware Stepper motor driven Z-linear axis, single-board PC, coin-guided teach-in, internal hard disk, menu-guided operation via shuttle wheel with confirmation button
Software Programmable single bonds, loop shapes can be saved
Control Manual, semi-automatic
Dimensions W x D x H – 63 x 58 x 40cm, weight approx. 30kg
Connections 100–230 VAC, 1 Phase, 50/60Hz, max 230VA, Ø6mm standard-vacuum tubing
Heater controller Integrated in the machine, 0–250°C

Workholder

Type Detail
Standard Ø80mm workholder with mechanical clamping
Optional – Large parts Workholder for parts up to 4×4″ with vacuum and mechanical clamping
Optional – TO TO workholder with mechanical clamping
Optional – Rubbered 4×4″ workholder with rubbered surface and mechanical clamping

5330 Thin Wire Wedge-Wedge Bonder

SKU: FSB-021

In Stock

FS BONDTEC 5330 Thin Wire Wedge-Wedge Bonder processes aluminium and gold wires from 17.5 to 75μm, with clamp-based ribbon bonding up to 250μm width. Ideal for small scale production, laboratory, prototyping, pre-series and repair applications, the FS BONDTEC 5330 Thin Wire Wedge-Wedge Bonder requires only minimal operator training.

SKU: FSB-021 Category:
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