FS BONDTEC 5380 Die-Bonder

• Programmable bond force from 5 to 500cN
• Manual, semi-automatic control
• Quick conversion from wire bonding to die bonding
• Fits all newer 53XX BDA wire bonders
• Standard DIE Collets accepted via transducer adapter
• High accuracy for a manual bonder
• Economical solution for sample builds and small production runs

The FS BONDTEC 5380 Die-Bonder extends the versatile 53XX BDA platform, which already bonds both wedge and ball bonds, by adding a third function: die bonding. With the FS BONDTEC 5380 Die-Bonder, only minimum hardware and software extensions are needed on the existing bonder — instead of the wire bond tool, an adapter is inserted directly into the transducer to accept standard DIE Collets used for chip bonding.

DIE Collets are available in a range