The FS BONDTEC 5380 die bonder adds die bonding to the versatile 53XX BDA wire bonder platform. That platform already makes both wedge and ball bonds, so the 5380 gives you a third function.

• Programmable bond force from 5 to 500cN
• Manual, semi-automatic control
• Quick conversion from wire bonding to die bonding
• Fits all newer 53XX BDA wire bonders
• Standard DIE Collets accepted via transducer adapter
• High accuracy for a manual bonder
• Economical solution for sample builds and small production runs

Minimal Changes Needed

You only need small hardware and software extensions on your existing bonder. Instead of the wire bond tool, an adapter fits straight into the transducer. It then accepts the standard DIE Collets used for chip bonding.

Quick Conversion

Switching from wire bonding to die bonding is fast. As a result, one machine can handle both jobs without long changeovers.

Controlled Bond Force

You can program bond force from 5 to 500cN. In addition, manual and semi-automatic control give operators flexibility.

Why Choose the 5380 Die Bonder?

It offers high accuracy for a manual bonder. Therefore, it is an economical solution for sample builds and small production runs.

For example, labs that already own a newer 53XX BDA bonder can add die attach without buying a separate machine. That saves both money and bench space.

Explore our full range of die bonding equipment to find the right system for your lab.