FS BONDTEC 5350 Heavy Wire Wedge Bonder

• Manual/semi-automatic control
• Aluminium wire 100–500μm and copper wire 100–300μm on 4″ spool
• Fully automatic wire cutting unit for reproducible, single-micron precision cuts
• Motorized Y-axis (25mm travel) for perfectly identical bond tails
• Programmable Voice-coil bond force system, 0 up to 1800cN
• Similar hardware/software to 5310, 5330 and 53XX BDA for low training and maintenance costs
• Bond head almost identical to fully automatic FS BONDTEC bonders for trouble-free scale-up

The 5350 Heavy Wire Wedge Bonder suits R&D labs, prototype runs, and repair facilities. It delivers top bond quality even on a limited budget. For example, its standout feature is a fully automatic wire cutting unit that guarantees reproducible cuts at single-micron precision. As a result, operators avoid the risk of component damage during every cycle.

Thanks to a motorized Y-axis with 25mm travel, plus the motorized Z-axis, this bonder produces identical bond tails. It does this through a programmable, automatic step-back. In addition, its hardware and software closely match the 5310, 5330, and 53XX BDA thin-wire bonders from the same family. Consequently, training and maintenance costs stay extremely low.

At the same time, the bond head on this machine closely resembles that of FS BONDTEC’s fully automatic bonders. Therefore, every bond meets the same high-quality standard, and scaling up to larger production volumes stays straightforward.

Typical users include university and industry research labs, contract manufacturers running short pilot batches, and service centers reworking heavy-wire modules. Meanwhile, manual and semi-automatic control let an operator fine-tune each bond. The system still relies on repeatable, machine-driven wire cuts for consistency. The platform shares its core hardware and software with the larger automatic 53xx family. As a result, moving a qualified process into full production later requires only minimal requalification work.

Bond System