The Rehm CondensoXC (XC) utilizes advanced condensation reflow technology, employing the medium Galden® to achieve heat transfer rates up to ten times higher than traditional convection soldering. This makes the XC particularly suitable for large, high-mass boards or complex assemblies that require precise thermal control. The system features a hermetically sealed process chamber and a repeatable injection principle for precise control of the reflow profile. For manufacturers requiring void-free results, the CondensoXC offers a controllable vacuum process both before and after soldering. The unit is designed for manual loading from the front and includes active Galden® filtering to ensure zero fluid loss during the process. With optional wireless WPS process monitoring for full traceability, the CondensoXC provides a reliable, high-efficiency vapor phase soldering solution for specialized and high-mass electronics.