The Rehm CondensoXC (XC) is a condensation soldering system that uses Galden® as its heat transfer medium. It achieves heat transfer rates up to ten times higher than traditional convection soldering.

Key Features of the CondensoXC Condensation Soldering System

• Up to 10x heat transfer
• Vacuum before and after soldering
• Perfect for large, high-mass boards

Ideal for High-Mass Assemblies

The high heat transfer rate makes the XC especially suited to large, high-mass boards. It also handles complex assemblies that need precise thermal control.

Precise Profile Control

The system has a hermetically sealed process chamber. In addition, a repeatable injection principle gives precise control of the reflow profile.

Void-Free Results

For manufacturers who need void-free joints, the CondensoXC offers a controllable vacuum process. This can run both before and after soldering.

Zero Fluid Loss

The unit is loaded manually from the front. As a result, it suits specialised and lower-volume work. Active Galden® filtering also ensures zero fluid loss during the process.

Why Choose This Condensation Soldering System?

Optional wireless WPS process monitoring gives you full traceability. So you can record and review every run with confidence.

Overall, the CondensoXC is a reliable, high-efficiency vapour phase soldering solution. For example, it is ideal for specialised and high-mass electronics that are hard to solder with convection.

Explore our full range of reflow soldering equipment to find the right system for your line.