Lead Free Solderpaste

Lead free solder paste supports environmentally responsible electronics manufacturing without compromising joint quality. Our range delivers reliable wetting, strong mechanical strength, and consistent results across reflow processes. Each formula suits a variety of applications, from fine-pitch components to high-volume production lines. Choose the right paste to meet RoHS compliance while maintaining strong, defect-free joints.

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Inventec 305-16 LVD T4 LF Solder Paste

Inventec 305-16 LVD T4 LF Solder Paste

  • • Melting point: 217°C
  • • Cuts voiding in QFN/DPAK joints
  • • Minimum pitch: 0.3mm
Inventec 305-16 T3 LF Solder Paste

Inventec 305-16 T3 LF Solder Paste

  • • Melting point: 217°C
  • • Excellent wetting on OSP finishes
  • • Reliable for high-density boards
Inventec 305-16 T4 LF Solder Paste

Inventec 305-16 T4 LF Solder Paste

  • • Melting point: 217°C (SAC305)
  • • Type 4 powder: 20-38 micron
  • • Perfect for micro-BGA, 0201
Inventec 305-21 T5 LF Solder Paste

Inventec 305-21 T5 LF Solder Paste

  • • Melting point: 217°C (SAC305)
  • • Type 5 powder: 15-25 micron
  • • Built for micro-BGA density
Inventec 405-6-85 NC LF Solder Paste

Inventec 405-6-85 NC LF Solder Paste

  • • Melting point: 217°C
  • • Built for syringe dispensing
  • • Surface resistance: >10¹⁰ Ω