- • Melting point: 183°C
- • Type 4 powder: 20-38 micron
- • Built for defense and aerospace
- • Melting point: 178°C
- • Silver-bearing for extra fatigue resistance
- • Built for medical and defense
- • Melting point: 217°C
- • Cuts voiding in QFN/DPAK joints
- • Minimum pitch: 0.3mm
- • Melting point: 217°C
- • Excellent wetting on OSP finishes
- • Reliable for high-density boards
- • Melting point: 217°C (SAC305)
- • Type 4 powder: 20-38 micron
- • Perfect for micro-BGA, 0201
- • Melting point: 217°C (SAC305)
- • Type 5 powder: 15-25 micron
- • Built for micro-BGA density
