Optimized for high-density microelectronic packaging, the FS BONDTEC 5330 is a manual thin wire wedge bonder capable of handling aluminum and gold wires from 17.5 to 75 μm, as well as ribbon up to 250 x 25 μm. The machine features a highly adaptable wire guide system, arriving as a 45° standard but retrofittable to 30° or 60° to accommodate specific component geometries and deep-access requirements. With its dual-frequency ultrasonic generator and programmable Z-axis (60mm) and Y-axis (25mm), the 5330 ensures consistent, high-quality wedge-wedge bonds for aerospace, defense, and medical hardware. The bond head is designed for “easy to operate” manual use while maintaining the technical sophistication needed for modern circuit layouts. Its ability to switch between wire and ribbon makes it an exceptionally flexible tool for laboratories and production facilities requiring a versatile, high-precision manual bonding station.