FS BONDTEC 5610i Ball-Wedge Bonder
- Semi-automatic gold ball bonder, fills the gap between manual and semi-automatic bonders
- Fully PC controlled, programs any number of bonds and bumps
- Cross hair targeting system for pre-programmed adjust points
- Two operating modes: single bond (manual-automatic) and multi wire (semi and fully automatic)
- Convertible to Thin Wire Wedge-Wedge, Heavy Wire, or pull-/shear tester by replacing the bond head
- Set-up time of approximately 3 minutes
The FS BONDTEC 5610i Ball-Wedge Bonder is a semi-automatic Gold Ball-Bonder that fills the gap between manual and semi-automatic ball bonders. Fully PC controlled, the FS BONDTEC 5610i allows any number of bonds and bumps to be programmed, with pre-programmed adjust points targeted through the camera’s cross hair targeting system before the programmed bonds or bumps are executed automatically.
Two operating modes are available on the FS BONDTEC 5610i: single bond for repairing various bond samples and making individual bonds (manual-automatic), and multi wire for teaching and bonding chips or various bond samples (semi and fully automatic). The bonder can also be used as a Thin Wire Wedge-Wedge or Heavy Wire bonder, as well as a pull-/shear tester, simply by replacing the bond head and loading the appropriate software.
With a set-up time of approximately 3 minutes, the FS BONDTEC 5610i offers fast conversion between processes, making it a flexible option for facilities that need to switch between different bonding tasks without long downtime.
Bond System
| Attribute | Detail |
|---|---|
| Wire types | Gold wire 12.5–50μm on 2″ spool |
| Bondhead | Ball-Wedge for gold wire, standard capillaries 16mm length (optional 19mm) |
| Ultrasonic System | F&S Generator 67kHz (optional 120, 130, 140kHz) |
Bonder Base
| Attribute | Detail |
|---|---|
| Axes | Working area X/Y-axis 100 x 100mm, step resolution 1μm programmable, programmable Z-axis with 60mm stroke |
| Hardware | Dual-Core PC with Windows OS Ethernet, USB 2.0/3.0, LCD colour display 22″, GigE-CMOS-Color camera, network compatible with program archiving |
| Software | Single bonds up to complex programs, loop shapes can be saved in libraries, optional pattern recognition |
| Placement accuracy | +/- 5μm @ 3 sigma, incl. tool / no wire on FS BONDTEC standard substrate |
| Repeatability | +/- 3μm @ 3 sigma, incl. tool / without wire on FS BONDTEC standard substrate |
| Loop height accuracy | +/- 5μm @ 3 sigma, for thin wire 5630 with 25μm aluminium wire on FS BONDTEC standard substrate |
| Speed | 1 wire / 2–3 seconds |
| Dimensions | W x D x H – 70 x 65 x 70cm, weight approx. 75kg |
| Connections | 100–240 VAC, 1 Phase, 50/60Hz, max 500VA, Ø6mm standard vacuum tubing |
| Heater controller | Integrated in the machine, 0–250°C |
Workholder
| Type | Detail |
|---|---|
| Standard | Workholder for parts up to 4×4″ with vacuum and mechanical clamping |
| Optional – Jaws | Workholders up to 4×4″ with jaws |
| Optional – TO | TO workholder with mechanical clamping |
| Optional – Rubberized | 4×4″ workholder with rubberized surface and mechanical clamping |
Reviews
There are no reviews yet.