NPM-W2 Production Modular

  • Higher productivity and quality via printing, placement and inspection process integration
  • Versatility for large PCBs and components
  • Support for large and heavy BGA placement with 15,000 BGA ball recognition
  • Placement for tall components up to 48mm including PCB thickness
  • APC-5M process control for stable operation and predictive maintenance
  • 2-head configuration, can install inspection head and dispensing head
  • 30-slot feeder cart and tray feeder cart support

The NPM-W2 is a highly versatile production modular that supports a variety of components and supply forms. Its 2-head machine configuration can install an inspection head and dispensing head, while the component supply section can be fitted with a 30-slot feeder cart and tray feeder cart to support a wide range of components. This makes the NPM-W2 well suited to variable-mix variable-volume production requiring advanced productivity, model changeover ability, and component adaptability.

For large and heavy BGA placement, a trend in the server industry, the NPM-W2 uses a nozzle designed for larger, heavier components combined with scanning operation based on component size, and can detect up to 15,000 BGA balls during recognition. The NPM-W2 also supports placement for tall components, avoiding interference between placement components, pick-up components, and head cameras — components can be mounted up to 48mm in height, including PCB thickness.

To maximize Overall Equipment Effectiveness (O.E.E.), the optional APC-5M system monitors and analyses unit conditions in real time, enabling predictive maintenance and reducing errors from unmaintained equipment. The NPM-W2 also integrates with inspection machines through the APC System (APC-FF/APC-MFB2) for variation control in solder printing and component placement. Skill-less, labour-saving features include remote error recovery operation and AOI information display directly on the machine screen when quality errors occur, helping reduce dependence on specific workers and improve productivity.

Main Specifications

Attribute Detail
PCB dimensions Single conveyor batch mounting: L50mm x W50mm to L750mm x W550mm; 2-position mounting: L50mm x W50mm to L350mm x W550mm; dual conveyor configurations available up to L750mm x W510mm
Placement head max speed 42,000cph (0.086s/chip); 35,000cph (0.103s/chip)
Placement head accuracy (Cpk≥1) ±40μm/chip; ±30μm/chip
Component dimensions 03015 chip to L120 x W90 x T30/T40, or L150 x W25 x T30/T40
Maximum component supply (4mm/8mm tape width) 120

The Panasonic NPM-W2 Production Modular

In Stock

The Panasonic NPM-W2 Production Modular is a highly versatile mounter supporting large PCBs and components, including large and heavy BGA placement. With printing, placement and inspection process integration alongside APC-5M process control, the NPM-W2 delivers higher productivity and quality across variable-mix variable-volume production.

Talk to a Specialist