NPM-GP/L Screen Printer

• High productivity through model changeover automation and production-time automation functions
• Real-time monitoring of equipment status optimizes maintenance timing
• Various functions for high-quality, stable printing responding to 5M changes
• Solder transfer and mask changer options for automated model switching
• APC-5M for optimized maintenance timing and expanded production time
• Variable angle attack squeegee and solder viscosity feedback for consistent print quality

Automated Model Changeover

The NPM-GP/L Screen Printer automates model changeover and other production operations for higher productivity. For example, it offers optional automation of model switching, including:

• Solder transfer, which automatically collects and feeds solder to the next model’s mask without losing solder shape
• Automatic replacement of bottom receiving pins
• A mask changer capable of stocking up to 10 masks

Similarly, during production, an optional automatic solder supply system — a pot with hole combined with a residual amount detection sensor — maintains the proper solder amount on the mask. In addition, a paper-free wiping unit reduces cleaning paper and solvent use.

Maintenance & Production Efficiency

Overall, appropriately timed maintenance, based on equipment condition monitoring, contributes to increased production time. In particular, the optional APC-5M system supports this by providing real-time visibility into unit status, which optimizes maintenance timing and expands available production time. As a result, various functions also realise high-quality, stable printing that responds to 5M changes, while M2M (Machine to Machine) communication with solder inspection equipment helps reduce defect losses.

Print Quality Control

For high printing quality, the NPM-GP/L Screen Printer supports a variable angle attack squeegee, adjustable from 45° to 70° in 1-degree increments via the APC-FB volume function. Additionally, it includes a pre-bend high filling squeegee for improved filling performance, plus materials matching to prevent setting errors across the mask, squeegee, lower receiving block, and solder.

Further quality functions, therefore, include solder viscosity feedback, mask tension feedback, and solvent discharge feedback, which together maintain consistent process conditions. Consequently, printing condition optimization control (APC-5M) adjusts printing pressure, squeegee speed, and plate separation speed based on SPI results to maintain optimal printing volume. Meanwhile, APC-FB (Position) and APC-FB (Volume) automatically correct print position and volume using the same SPI data.

Main Specifications