FS BONDTEC Series 58 Wire Bonder
- Complete, high productivity tabletop wire bonder at over 1 wire per second
- Exchangeable bond heads for all wire bond processes
- Fully automatic wire bonding with manual parts feeding
- Store an unlimited number of bond programs
- Extremely adaptable bond settings, loop shapes, force and power profiles
- Most powerful pattern recognition system on the market
- Innovative software
First, the FS BONDTEC Series 58 Wire Bonder is a complete, high productivity tabletop wire bonder capable of over 1 wire per second. As a result, it’s the perfect production machine for small to medium production volumes with the highest quality requirements. In addition, exchangeable bond heads support all wire bond processes, so the FS BONDTEC Series 58 Wire Bonder delivers fully automatic wire bonding with manual parts feeding.
The FS BONDTEC Series 58 Wire Bonder can also store an unlimited number of bond programs. Specifically, its extremely adaptable bond settings, loop shapes, force, and power profiles give operators precise control over the bonding process. Furthermore, its pattern recognition system is the most powerful on the market, paired with innovative software to streamline setup and repeatable production runs.
Exchangeable Bond Heads
| Bond Head | Type | Key Specifications |
|---|---|---|
| 5810 | Gold-Ball | Gold-ball bonding for wires from 12.5 to 50μm using standard capillaries 16–19mm, contactless electronic touchdown sensor, digitally controlled programmable bond force, digital ultrasonic generator, bumping, safety-bump, stitch-on-ball, Deformation Limit Control (DLC) |
| 5830 | Thin Wire Wedge-Wedge | Wedge-wedge bonding using 1″ tools for aluminium and gold wires from 17.5 to 75μm, 45° wireguide (convertible to 30° or 60° depending on component geometry), digital ultrasonic generator, DLC included |
| 5832 | Thin Wire Deep Access | Deep Access Wedge-Wedge bonding using 1″ or ¾” tools, 90° wireguide for aluminium and gold wires from 17.5 to 75μm, ideal for difficult and constricted bonding geometries, suited to aluminium and gold ribbons, DLC included |
| 5850 | Heavy Wire | Aluminium wire bonding from 100 up to 500μm diameter, copper wire from 100 up to 300μm diameter, wedge lengths of 50 up to 70mm for extreme requirements, stitch or chain bonds of any length, clip-on wireguide for quick exchange, DLC included |
| 5850 HR | Heavy Ribbon | Aluminium ribbons up to 2mm width, increased programmable bond force up to 6,000cN with force and power ramps, active ribbon guide for improved loop shaping, DLC included, optional convertible from standard 5850 bond head |
