Series 56i Wire Bonder
- Unbeatable flexibility
- Changeable bond heads for all wire bond and testing processes
- Fully automatic bonding with manual part feeding
- Store an unlimited number of bond programs
- Extremely adaptable bond settings, loop shapes, force and power profiles
- Most powerful pattern recognition system on the market
- Innovative and intuitive programmable software
- Travel distances 100 x 100mm
- 6 in 1 platform
The Series 56i Wire Bonder is a fully automatic bonding machine with manual part feeding, built to deliver unbeatable flexibility across a wide range of wire bonding and testing applications. With changeable bond heads, the Series 56i Wire Bonder adapts to gold-ball bonding, thin wire wedge-wedge, deep access bonding, heavy wire, heavy ribbon and automatic pull and shear testing, making it a genuine 6-in-1 solution for production environments.
The Series 56i Wire Bonder can store an unlimited number of bond programs, with extremely adaptable bond settings, loop shapes, force and power profiles giving operators precise control over the bonding process. Its pattern recognition system is the most powerful on the market, working alongside innovative and intuitive programmable software to streamline setup and repeatable production runs.
With travel distances of 100 x 100mm and Deformation Limit Control (DLC) across most bond heads for real-time quality checks, the Series 56i Wire Bonder is well suited to in-house production requiring high accuracy, repeatability and process flexibility without the need for multiple dedicated machines.
Exchangeable Bond Heads
| Bond Head | Type | Key Specifications |
|---|---|---|
| 5610i | Gold-Ball | Wires 12–50 μm, standard capillaries 16–19mm, contactless electronic touchdown sensor, digitally controlled programmable bond force, digital ultrasonic generator, bumping, safety-bump, stitch-on-ball, Deformation Limit Control (DLC) |
| 5630i | Thin Wire Wedge-Wedge | 1″ tools, aluminium/gold wires 12–75 μm, 45° wireguide (convertible to 30°/60°), digital ultrasonic generator, DLC for real-time quality checks |
| 5632i | Thin Wire Deep Access | 1″ or ¾” tools, 90° wireguide, aluminium/gold wires 12–75 μm, suited to constricted geometries, ideal for aluminium and gold ribbons, DLC included |
| 5650i | Heavy Wire | Aluminium wire 100–500 μm, copper wire 100–300 μm, wedge lengths 50–70mm, stitch or chain bonds of any length, clip-on wireguide, DLC included |
| 5650i HR | Heavy Ribbon | Aluminium ribbons up to 2mm width, programmable bond force up to 6,000 cN with force/power ramps, active ribbon guide, DLC included, optional convertible from standard 5650 bond head |
| 5600Ci | Automatic Pull & Shear Tester | Test heads with exchangeable cartridges, camera for automatic testing, analysis software |
