• Dielectric heat transfer fluid dedicated to 1-phase immersion and direct cooling systems
  • Colorless, clear liquid with >99.5% purity
  • Non-flammable with no flash point, and non-toxic with no hazard classifications
  • Zero ozone depletion potential (ODP); recyclable through the ECOPROGRAM service
  • Low pour point (-38°C/-36°F) and low kinematic viscosity (0.71 cSt @20°C), reducing pump energy consumption
  • High dielectric strength (40 kV, 0.1″ gap @25°C), providing strong electrical insulation for equipment run under power while submerged
  • Excellent thermal conductivity and very low surface tension (15 dynes/cm²) for efficient heat transfer
  • Thermally and chemically stable during use, supporting cost-efficient long-term performance
  • Compatible with most metals, plastics, and elastomers (pre-use testing recommended)
  • Suitable for single-phase immersion cooling, cold plate/tube direct cooling, ion implanters, dry etchers, CVD machine cooling, and dielectric testing

Technical Specifications

Specification Value
Appearance Colorless, Clear
Purity >99.5%
Flash Point None
Boiling Point 98°C / 208°F
Pour Point -38°C / -36°F
Critical Temperature 285°C / 545°F
Vapor Pressure (@20°C) 5.9 kPa
Heat of Vaporization (@BP) 102 kJ/kg
Liquid Density (@20°C) 1660 kg/m³
Kinematic Viscosity (@20°C) 0.71 cSt
Surface Tension 15 dynes/cm²
Dielectric Strength (0.1″ gap @25°C) 40 kV
Dielectric Constant (@1kHz/25°C) 2.09
Solubility (Fluid in Water) 586 ppb
Solubility (Water in Fluid) 67 ppb
Ozone Depletion Potential (ODP) None
Operating Range -28°C to 85°C

Thermasolv CF4

In Stock

Thermasolv CF4 is a dielectric heat transfer fluid designed for single-phase immersion and direct cooling systems, allowing electronics to operate safely while submerged and energized. With a boiling point of 98°C, dielectric strength of 40 kV, and low viscosity of 0.71 cSt, Thermasolv CF4 delivers excellent thermal conductivity and efficient heat transfer while minimizing pump energy consumption. Its non-flammable, non-toxic, chemically stable formulation makes Thermasolv CF4 a reliable choice for immersion cooling, direct cooling, and semiconductor process cooling applications.

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