- • Boiling point: 170°C
- • Operates -100°C to 160°C
- • Ideal for immersion cooling
- • Boiling point: 110°C
- • Dielectric strength: 39.4kV
- • Ideal for immersion cooling
- • Boiling point: 120°C
- • Dielectric strength: >35.7kV
- • Ideal for immersion cooling
- • Boiling point: 98°C
- • Dielectric strength: 40kV
- • Perfect for semiconductor cooling
- • Boiling point: 110°C
- • Ultra-low GWP: 2.5
- • Ideal for semiconductor cooling
- • Boiling point: 158°C
- • Dielectric strength: 40kV
- • Ideal for immersion cooling
- • Boiling point: 61°C
- • Dielectric strength: 28kV
- • Ideal for data center cooling
- • Boiling point: 76°C
- • Dielectric strength: >25kV
- • Works for 1 and 2-phase cooling
- • Boiling point: 111°C
- • Plant-based, biodegradable
- • Ideal for direct-to-chip cooling
