The Viscom X 8011-II is a premium 3D manual X-ray inspection system (MXI). It gives in-depth analysis of hidden solder joints in high-reliability electronics.

Key Features of the X 8011-II X-Ray Inspection System

• 2D and 3D CT imaging
• 360° rotation and high-angle views
• Perfect for BGA and QFN inspection

See What Optics Cannot

The system is essential for inspecting BGAs, QFNs and BTCs. In these parts, traditional optical inspection cannot reach the joints.

Clear 2D and 3D Images

A high-resolution X-ray tube works with a digital flat-panel detector. As a result, the X 8011-II produces very clear 2D and 3D (computed tomography) images.

Find Hidden Defects

Its flexible gantry allows high-angle views and 360° rotation of the assembly. So engineers can spot internal voids, head-in-pillow defects and micro-cracks with ease.

Powerful Software

The software includes automated void calculation and bond wire inspection. In addition, it supports failure analysis, process optimisation and quality assurance.

Why Choose This X-Ray Inspection System?

The X 8011-II is compact yet very capable. For example, it suits aerospace, defence and medical electronics where hidden faults are not acceptable.

Therefore, it gives you the visibility you need to confirm the integrity of complex, high-value assemblies.

Where It Adds Value

Hidden joint defects often only show up after a product reaches the field. However, the X 8011-II lets your team find them during development and production instead.

For example, engineers can check a new stencil design or reflow profile and see the effect on voiding straight away. As a result, they can fine-tune the process before full production begins.

It also supports root cause work when a board fails. In that case, 3D images help show exactly where and why a joint broke, without cutting the board apart.

Explore our full range of X-ray inspection equipment to find the right system for your QA needs.