The Viscom X 8011-II is a premier 3D Manual X-ray Inspection (MXI) system designed for the deep-dive analysis of hidden solder joints in high-reliability electronics. This system is indispensable for inspecting BGAs, QFNs, and BTCs where traditional optical inspection cannot reach. Featuring a high-resolution X-ray tube and a sophisticated digital flat-panel detector, the X 8011-II produces exceptionally clear 2D and 3D (Computed Tomography) images. Its flexible gantry allows for high-angle views and 360-degree rotation of the assembly, enabling engineers to identify internal voids, head-in-pillow defects, and micro-cracking with ease. The system includes powerful software for automated void calculation and bond wire inspection, making it an essential tool for failure analysis, process optimization, and quality assurance in aerospace, defense, and medical electronics. Compact yet incredibly powerful, the X 8011-II provides the hidden-detail visibility required to guarantee the structural integrity of complex, high-value assemblies.