The Tresky T4909 is a budget-friendly manual die bonder that puts ergonomics and high precision first. It is ideal for R&D and small-scale production.
Key Features of the T4909 Manual Die Bonder
- ±10μm placement accuracy
- Unlimited 360° spindle rotation
- Perfect for labs and R&D
True Vertical Technology™
Tresky’s True Vertical Technology™ keeps the chip and substrate parallel at any bond height. As a result, you get consistent joint quality on every bond.
Easy Touchscreen Control
An integrated Raspberry PC with a touchscreen runs the machine. So you can program bonding sequences for epoxy, eutectic, ultrasonic and flip-chip work with ease.
Compact and Capable
The T4909 offers ±10μm placement accuracy and unlimited 360° spindle rotation. In addition, it all fits in a compact 33kg tabletop unit.
Optional beam splitter optics also let you view two objects at once through optical overlay.
Why Choose This Manual Die Bonder?
The T4909 is a highly accurate and flexible workhorse for laboratories. For example, it suits teams that need professional die attach without the cost of a fully automated system.
Therefore, it is a smart first step into precision bonding. You get high accuracy today, with room to grow later.
Explore our full range of die bonding equipment to find the right system for your lab.
