The Rehm VisionXP+ (VXP+) is a best-in-class energy efficient reflow system. It puts energy savings and sustainability first while delivering high-reliability convection soldering.

Key Features of the VXP+ Energy Efficient Reflow System

• Vacuum module down to 2 mbar
• Outer panels under 15°C above room
• Perfect for power electronics and BGAs

Less Heat Lost

EC motors and durable insulation greatly reduce heat loss to the room. As a result, the outside panels stay no more than 15°C above room temperature.

Void Reduction With Vacuum

An integrated vacuum module reaches 2 mbar. So it effectively reduces voids in solder joints for power electronics and BGA devices.

Full Control of Consumption

The VXP+ gives you full control over nitrogen and energy use, even in standby. Therefore, your carbon footprint drops significantly.

Three-Part Conveyor

A three-part conveyor covers preheating, vacuum and cooling. In addition, the system offers outstanding traceability and highly efficient residue management.

Why Choose This Energy Efficient Reflow System?

The VXP+ suits eco-conscious manufacturers who also need high-performance results. For example, it lets you cut running costs while improving joint quality on demanding assemblies.

Explore our full range of reflow ovens to find the right system for your line.