FS Bondtech Ball Deep AccessFS Bondtech Ball Deep Access

90° Wire orientation for Aluminium- und Gold wire from 17,5 bis 75 µm

   

Easy to Operate and erconomical use

  •  Deep Access Wedge-Wedge-Bonding with 1“ or ¾“ Tools
  •  90° wireguide for Aluminum- and Goldwires from 17,5 to 75 μm
  • Gold-Ball-Bonding for wires from 17,5 to 50 μm with capillaries 16 -19 mm
  • Perfect for difficult and constricted bonding geometries
  • Also useable for ribbon of aluminum und gold
  • Programmable Z-Axis 60 mm and Y-Axis 25 mm
  • optional: retrofitable to 5380 DIE-Bonder

Cart Information


53XX BDA – Ball-Deep Access

90° Wire orientation for Aluminium- und Gold wire from 17,5 bis 75 µm