The FS Bondtec 5630i is a semi-automatic thin wire wedge-wedge bonder. It fills the gap between a manual wedge bonder and a fully automatic machine. As a result, it gives labs and small production runs the speed of automation without the cost of a full system.
Why choose the FS Bondtec 5630i?
Manual bonding is slow and depends heavily on operator skill. However, a fully automatic bonder is often too costly for small batches. For this reason, the 5630i combines the best of both.
It is built on the 5600i series platform and is fully PC controlled. You can program any number of bonds. First, you target the pre-set adjust points with the camera cross hair. Then the bonder runs the programmed bonds automatically.
The machine is also very flexible. By changing the bond head and software, you can convert it to a gold wire bonder, a heavy aluminium wire bonder or a pull and shear tester. In addition, set-up takes only about three minutes, so changeovers cause very little downtime.
Key features
- Semi-automatic thin wire wedge-wedge bonding
- Fully PC controlled, based on the 5600i series
- Cross hair targeting for pre-programmed adjust points
- Single bond mode for repairs and one-off bonds
- Multi wire mode for teaching and bonding chips
- Converts to gold wire, heavy wire or pull and shear testing
- Set-up time of about three minutes
FS Bondtec 5630i specifications
Bond System
| Attribute | Detail |
|---|---|
| Wire types | Aluminium and gold wire 12.5–75μm on 2″ spool |
| Bondhead | Wedge-Wedge for thin wire, standard wedges of 1″ length, 45° wire feed, motorized wire spool (optional) |
| Ultrasonic System | F&S Generator 100kHz (optional 65, 140kHz) |
Bonder Base
| Attribute | Detail |
|---|---|
| Axes | Working area X/Y-axis 100 x 100mm, step resolution 1μm programmable, programmable Z-axis with 60mm stroke |
| Hardware | Dual-Core PC with Windows OS Ethernet, USB 2.0/3.0, LCD colour display 22″, GigE-CMOS-Color camera, network compatible with program archiving |
| Software | Single bonds up to complex programs, loop shapes can be saved in libraries, optional pattern |
Where to use the FS Bondtec 5630i
This bonder suits sites that need flexible, repeatable wire bonding. For example, it is a good fit for:
- Research and development labs
- Prototype and small batch production
- Repair of bond samples
- Sensor, hybrid and microelectronics assembly
Need help choosing a wire bonder?
OnBoard Solutions supplies microelectronics equipment to manufacturers and research teams across Australia. You can browse our full wire and ribbon bonder range or view our bond testers. To learn more about electronics assembly standards, visit the IPC website. Alternatively, contact our team to discuss the FS Bondtec 5630i for your application.
