Series 5630 Thin Wire Wedge-Wedge
Exchangable Bondhead 5630
- Wegde-wedge bonding using 1″ tools for aluminum and gold wirdes from 17,5 to 75 µm strength
- 45° wire guide. convertible to 30° or 60° – depending on compontent geometry
- Digital ultrasonice generator provides adjustable bond frequencies
- Deformation Limit Controll (DLC) for real-time qualitiy check and process monitoring
Series 5630 Thin Wire Wedge-Wedge
$0.00
Exchangable Bondhead 5630
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