FS BONDTEC 5630i Thin Wire Wedge-Wedge Bonder
- Semi-automatic wedge-wedge bonder, fills the gap between manual wedge and fully automatic bonders
- Based on the 5600i series, fully PC controlled
- Cross hair targeting system for pre-programmed adjust points
- Two operating modes: single bond (manual-automatic) and multi wire (semi and fully automatic)
- Convertible to Gold Wire or Alu Heavy Wire, or pull-/shear tester, by replacing the bond head
- Set-up time of approximately 3 minutes
The FS BONDTEC 5630i Thin Wire Wedge-Wedge Bonder is a semi-automatic Wedge-Wedge Bonder that fills the gap between the manual wedge bonder and a fully automatic bonder. Built on the 5600i-series platform, the FS BONDTEC 5630i is fully PC controlled and allows any number of bonds to be programmed, with pre-programmed adjust points targeted through the camera’s cross hair targeting system before the programmed bonds are executed automatically.
Two operating modes are available on the FS BONDTEC 5630i: single bond for repairing various bond samples and making individual bonds (manual-automatic), and multi wire for teaching and bonding chips or various bond samples (semi and fully automatic). The bonder can also be used as a Gold Wire or Alu Heavy Wire bonder, as well as a pull-/shear tester, simply by replacing the bond head and loading the appropriate software.
With a set-up time of approximately 3 minutes, the FS BONDTEC 5630i offers fast conversion between bonding processes, making it well suited to facilities that need flexibility without lengthy changeover downtime.
Bond System
| Attribute | Detail |
|---|---|
| Wire types | Aluminium and gold wire 12.5–75μm on 2″ spool |
| Bondhead | Wedge-Wedge for thin wire, standard wedges of 1″ length, 45° wire feed, motorized wire spool (optional) |
| Ultrasonic System | F&S Generator 100kHz (optional 65, 140kHz) |
Bonder Base
| Attribute | Detail |
|---|---|
| Axes | Working area X/Y-axis 100 x 100mm, step resolution 1μm programmable, programmable Z-axis with 60mm stroke |
| Hardware | Dual-Core PC with Windows OS Ethernet, USB 2.0/3.0, LCD colour display 22″, GigE-CMOS-Color camera, network compatible with program archiving |
| Software | Single bonds up to complex programs, loop shapes can be saved in libraries, optional pattern
5630i Thin Wire Wedge-Wedge BonderSKU: FSB-414-2 In Stock FS BONDTEC 5630i Thin Wire Wedge-Wedge Bonder is a semi-automatic bonder that fills the gap between manual wedge and fully automatic bonders. Built on the 5600i-series PC-controlled platform, the FS BONDTEC 5630i allows any number of bonds to be programmed, with a setup time of around 3 minutes. |
