NPM-GW Modular Placement Machine
- Supports large components and large PCBs for EV and DX production demand
- APC-5M process control for stable operation and predictive maintenance
- Auto Setting Feeder (ASF) automates component supply operations
- Placement head handles 0201 parts up to large, tall components
- Supports large and heavy BGA placement with 15,000 BGA ball recognition
- High load placement (100N) for tall components up to 53mm, including automated DIMM connector placement
- Remote operation for offsite error recovery
The NPM-GW is a modular placement machine compatible with a wide range of components and PCBs, enabling a flexible production line. Its basic performance has been improved through renewed core units, including the placement head and recognition camera, allowing the NPM-GW to support a wide range of components, various component supply configurations, and larger PCBs.
The NPM-GW’s new placement head configuration flexibly handles everything from 0201 parts to large and tall components, delivering high productivity placement — approximately 23% better than the previous NPM-W2 model at the ±25μm accuracy level. For large and heavy BGA placement, a trend in the server industry, the NPM-GW uses a nozzle designed for heavier components combined with scanning operation based on component size, and can detect up to 15,000 BGA balls during recognition.
High load placement of 100N on the NPM-GW eliminates pin floating, while tall component mounting up to 53mm (including PCB thickness) allows for automated DIMM connector placement. Three types of supply section units can be combined to suit a variety of layouts, and supported PCB sizes have been expanded to accommodate a wider range of industries — when the transfer direction dimension exceeds 760mm, PCB size support can extend up to 1,050mm, or 1,260mm with a front/rear extension conveyor.
To maintain high quality placement, the optional APC-5M system monitors and analyses unit conditions in real time, enabling predictive maintenance and helping prevent errors from lack of maintenance. The NPM-GW also supports variation control through the APC System (APC-FF/APC-MFB2), which integrates with inspection machines to maintain mounting quality via feed-forward or feedback correction. Skill-less and labour-saving features, including the Auto Setting Feeder and remote error recovery operation, help reduce dependence on specific workers and improve overall productivity.
Main Specifications
| Attribute | Detail |
|---|---|
| PCB dimensions | Single conveyor batch mounting: L50mm x W50mm to L760mm x W687mm; 2 position mounting: L50mm x W50mm to L360mm x W687mm; dual conveyor and slide mounting configurations available up to L1,050mm/1,260mm |
| Placement head max speed | 52,000cph (0.069s/chip) |
| Placement head accuracy (Cpk≥1) | ±25μm/chip |
| Component dimensions | 0201 chip to L120 x W90 x T40/T45, or L150 x W25 x T40/T45 |
| Maximum component supply (4mm/8mm tape width) | 136 |