FS BONDTEC 5350 Heavy Wire Wedge Bonder

• Manual/semi-automatic control
• Aluminium wire 100–500μm and copper wire 100–300μm on 4″ spool
• Fully automatic wire cutting unit for reproducible, single-micron precision cuts
• Motorized Y-axis (25mm travel) for perfectly identical bond tails
• Programmable Voice-coil bond force system, 0 up to 1800cN
• Similar hardware/software to 5310, 5330 and 53XX BDA for low training and maintenance costs
• Bond head almost identical to fully automatic FS BONDTEC bonders for trouble-free scale-up

FS BONDTEC 5350 Heavy Wire Wedge Bonder is ideally suited for R&D labs, prototype and pilot production, and repair facilities that need the highest bond quality on a limited budget. Its most outstanding feature is a fully automatic wire cutting unit, guaranteeing perfectly reproducible wire cuts at single-micron precision without any risk of component damage.

Thanks to a motorized Y-axis with 25mm travel in addition to the motorized Z-axis, the FS BONDTEC 5350 Heavy Wire Wedge Bonder also offers perfectly identical bond tails through a programmable, automatic step-back. Hardware and software are very similar to the 5310, 5330 and 53XX BDA thin-wire bonders from the 53xx family, keeping training and maintenance costs extremely low.

At the same time, the bond head on the FS BONDTEC 5350 Heavy Wire Wedge Bonder is almost identical to that of FS BONDTEC’s fully automatic bonders, ensuring bonds of the highest quality and making scale-up to larger production volumes trouble-free.

Bond System