Epotek H70E is a premier, thermally conductive and electrically insulating two-component epoxy specifically designed for high-reliability microelectronic and power packaging applications. This specialized material features a high glass transition temperature and exceptional thermal management capabilities, making it the definitive choice for heat sink attachment, chip-on-board (COB) assembly, and power module encapsulation. The H70E is a “heat-cure only” system, which provides a remarkably long pot life (up to 4 days) and a stable viscosity that is ideal for high-speed industrial dispensing or screen printing. As a NASA-approved low-outgassing adhesive, it is a trusted material for space-grade and high-vacuum environments where outgassing could compromise sensitive optics or semiconductor performance. Its rugged chemical resistance and ability to withstand extreme thermal cycling ensure that heat-generating components remain securely bonded and thermally optimized throughout the lifecycle of the device.