The Rehm CondensoX-Line brings high-performance vacuum condensation soldering to the automated SMT production line. This in-line system is engineered to produce void-free solder joints in a completely inert process environment with residual oxygen levels below 100ppm, making it the ideal choice for IGBT modules, power electronics, and sensitive sub-modules like 01005 components. The X-Line utilizes a multi-chamber structure to achieve significantly higher throughput than stand-alone systems, all while maintaining horizontal transport throughout the entire process. Its unique injection system allows for a reliable and repeatable soldering process that is easily integrated into standard SMD lines. With best-in-class traceability and a cooling section that protects against oxidation, the CondensoX-Line is the definitive solution for high-volume manufacturers who require the thermal benefits of vapor phase soldering without sacrificing speed.