Epotek OG116-31 is a premier, single-component UV-curable epoxy specifically designed for rapid-cycle assembly of high-performance optical and microelectronic components. This high-solids adhesive is engineered for an exceptionally high glass transition temperature, ensuring that optical alignments and structural bonds remain stable under elevated operating temperatures. It reaches full structural strength in seconds under UV exposure, becoming tack-free and highly resistant to chemicals and moisture. OG116-31 is a favorite in the fiber optic and semiconductor industries for lens bonding, glob top sealing, and the encapsulation of sensitive sensors. Its low-viscosity, non-flowing rheology allows for precision application without migration into “keep-out” zones. By providing a high-strength, environmentally stable joint in seconds, OG116-31 maximizes throughput while maintaining the rigorous quality standards required for advanced aerospace and telecommunications hardware.