The Series 56xx Semi-Automatic Bonder from FS BONDTEC is a “Desktop Factory” that offers unbeatable flexibility for all bonding and testing applications through its innovative system of exchangeable bondheads. This semi-automatic platform allows for fully automatic bonding cycles with manual part feeding, making it a perfect bridge between prototyping and full-scale production. It features the most powerful pattern recognition system on the market and a generous 150 x 150mm substrate work area. The intuitive software allows users to store an unlimited number of bond programs with highly adaptable settings for loop shapes, force profiles, and power settings. Beyond wire and ribbon bonding, the 56xx can also be utilized as a pull and shear tester, providing a complete quality control and assembly solution in a single desktop unit. It is the ultimate choice for manufacturers who require high-precision automated results with the adaptability of a manual system.