- GEN3’s premier solderability tester — the latest evolution of the Multicore Universal Solderability Tester (MUST)
- Comprehensive solderability testing system fully compliant with all major international standards
- Automatic component alignment and testing, with immediate pass/fail results upon completion
- Step and repeat capability for multi-leaded devices
- Four individual globule blocks for wetting balance testing (4mm, 3.2mm, 2mm, and 1mm)
- Force resolution of 0.001mN, with sampling rate better than 0.1mN/BIT
- Immersion depth of 0–30mm at 0.01mm resolution
- Capable of testing components down to 0201 device size
- Superior Gauge R&R performance with integrated USB camera
- Quiet, smooth, and fast operation
- Tests in compliance with IEC, IPC, MIL STD, EIA/JEDEC, ISO, JEITA, JNC, and user-specific methods
- Helps identify solderability issues early, reducing costly rework and preventing defects like poor soldering and cold joints
- Includes 4 globule sizes, SnPb and lead-free solder pellets, 3 flux types (SMNA, Actiec 2, Actiec 5), 15 component clips, a comprehensive testing manual, and an NPL best practice guide
Technical Specifications
| Specification | Value |
|---|---|
| Dimensions (H x W x D) | 520mm x 810mm x 340mm |
| Weight | 60 kg |
| Power (Option 1) | 220–240V AC, 50Hz, 3.15A |
| Power (Option 2) | 110V AC, 60Hz, 6.30A |
| Force Resolution | 0.001mN |
| Immersion Depth | 0–30mm at 0.01mm resolution |
| Sampling Rate | Better than 0.1mN/BIT |
| Testing Capability | Down to 0201 devices |
| Globule Sizes / Pellet Weights | 4mm (200mg), 3.2mm (100mg), 2mm (25mg), 1mm (5mg) |
| Compliance Standards | IEC, IPC, MIL STD, EIA/JEDEC, ISO, JEITA, JNC |
