• Advanced HATS² (Highly Accelerated Thermal Shock) tester for simulating convection reflow assembly and evaluating PCB/substrate reliability, including plated through holes (PTHs)
• Wide operating temperature range of -65°C to +265°C
• Supports up to 1,000 thermal shock cycles per week
• Reduces cycle time by 60-80% compared to traditional thermal shock methods
• Temperature equalization in just 3-6 minutes, versus 30 minutes for dual chamber systems
• Uses high-speed air as the heat transfer mechanism for maximum possible transfer rate, closely replicating classic dual chamber technique
• Chamber capacity of 72 IPC-2221B “D” coupons or 36 single-via/custom coupons, supporting up to 252 total test nets per load
• Real-time, in-situ 4-wire resistance monitoring, capable of measuring resistances below 0.001 Ohm
• Detects barrel cracking and interconnection separation as they occur, with single-via testing offering greater sensitivity than daisy-chain methods
• Supports air-to-air thermal shock and convection reflow simulation, plus custom thermal/reflow profile creation and multiple consecutive reflow cycles
• Compliant with IPC-TM-650 Method 2.6.7.2C (air-to-air thermal shock) and Method 2.6.27B (convection reflow simulation)
• Ideal for high-reliability industries including aerospace, defence, medical devices, and electronics manufacturing

Technical Specifications